The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1103-1110

  Jang, Guh Yaw ^a   Lee, Jyh Wei ^b   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TUNG NAN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Elastic modulus; Hardness; Intermetallic compound (IMC); Sn Ag solder

Indexed keywords

ELASTIC MODULI; HARDNESS; NANOTECHNOLOGY; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SOLDERED JOINTS; THICKNESS MEASUREMENT; TIN ALLOYS;

NANOINDENTATION; SN-AG SOLDER; UNDER BUMP METALLIZATION (UBM);

SOLDERING ALLOYS;

EID: 7044228256     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0111-0     Document Type: Conference Paper

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