Evaluation of solder joint reliability in flip-chip packages during accelerated testing

Journal of Electronic Materials

Volumn 34, Issue 12, 2005, Pages 1550-1557

  Kim, Jong Woong ^a   Kim, Dae Gon ^a   Hong, Won Sik ^b,c   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Korea Electronic Technology Institute (KETI)   (South Korea)

^c Hankuk Aviation University   (South Korea)

Author keywords

Fatigue; Finite element analysis; Flip chip; Reliability; Sn 3.0Ag 0.5Cu

Indexed keywords

BRITTLE FRACTURE; CRACKS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; SOLDERED JOINTS; STRAIN; VISCOPLASTICITY;

BUMPED FLIP-CHIP PACKAGES; THERMAL SHOCK TEST; THERMALLY ACTIVATED SOLDERS;

FLIP CHIP DEVICES;

EID: 30144433622     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0164-8     Document Type: Conference Paper

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