Thermomechanical fatigue damage evolution in SAC solder joints

Materials Science and Engineering: A

Volumn 445-446, Issue , 2007, Pages 73-85

  Matin, M A ^a   Vellinga, W P ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Finite element analysis; Orientation imaging microscopy; Pb free solder; Persistent slip band; Thermomechanical fatigue

Indexed keywords

CYCLIC LOADS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; THERMAL LOAD; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

LEAD-FREE SOLDER; ORIENTATION IMAGING MICROSCOPY; PERSISTENT SLIP BAND; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

CYCLIC LOADS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; SOLDERED JOINTS; THERMAL LOAD; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

EID: 33845896801     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.09.037     Document Type: Article

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