Improvement in drop shock reliability of Sn-1.2Ag-0.5Cu BGA interconnects by Ni addition

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 78-84

  Tanaka, Masamoto ^a   Sasaki, Tsutomu ^a   Kobayashi, Takayuki ^a   Tatsumi, Kohei ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; HARDNESS; IMPACT TESTING; RELAXATION PROCESSES; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS;

BALL GRID ARRAY (BGA); DROP SHOCKS; LATTITCE DISTORTION;

CHIP SCALE PACKAGES;

EID: 33845597333     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645629     Document Type: Conference Paper

References (8)

1. JESD22-111, Board Level Drop Test Method of Compornents for Handheld Electronic Product, JEDEC Solid State Technology Association, July 2003.
2. rd Electronic Compornents and Technology Conf. 2003, pp.317-322.
3. th Electronic Compornents and Technology Conf. 2004, pp. 1304-1309.
4. S. Terashima, Y. Kariya, T. Hosoi and M. Tanaka, "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects" J. Eelectrom. Mater. Vol 32, No. 12(2003)pp1527-1533
5. S. Terashima, Y. Kariya, and M. Tanaka, "Improvement on Thermal Fatigue Propeties of Sn-1.2Ag-0.5Cu Flip-Chip Interconnects by Nickel Addition" Material Transactions,. Vol 45, No. 3 (2004) pp673-680
6. S. Terashima and M. Tanaka, "Thermal Fatigue Propeties of Sn-1.2Ag-0.5Cu-xNi Flip-Chip Interconnects" Material Transactions,. Vol 45, No. 3, pp681-688 (2004)
7. S. Terashima, K. Takahama, M. Nozaki and M. Tanaka, " Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder" Material Transactions,. Vol 45, No. 4 (2004) pp1383-1390
8. C. Xu, G. T. Galyon, S. Lai, B. Notohardjono and A. Frye, The report "ECTC2005 iNEMI tin whisker modeling committee"