Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging

Journal of Electronic Materials

Volumn 36, Issue 11, 2007, Pages 1501-1509

  Cho, Moon Gi ^a   Kang, Sung K ^b   Shih, Da Yuan ^b   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Cu consumption; Interfacial reaction; Intermetallic compounds; Thermal aging; Void suppression; Zn addition

Indexed keywords

COPPER CONSUMPTION; INTERFACIAL REACTION; VOID SUPPRESSION;

COPPER; INTERMETALLICS; REACTION KINETICS; SOLDERING ALLOYS; SUBSTRATES; THERMAL AGING; TIN;

ZINC;

EID: 35248860213     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0254-x     Document Type: Conference Paper

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