Additive effect of Kirkendall void formation in Sn-3.5Ag solder joints on common substrates

Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 45-50

  Gao, Feng ^a   Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Additive; Diffusion; Kirkendall void; Lead free solder; Sn 3.5Ag; Thermodynamics

Indexed keywords

ELECTRONICS SUBSTRATES; KIRKENDALL VOIDS; LEAD-FREE SOLDERS; ORGANIC SOLDERABILITY PRESERVATIVE (OSP);

ADDITIVES; DIFFUSION; HIGH TEMPERATURE EFFECTS; THERMODYNAMICS; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 37249016980     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0234-1     Document Type: Article

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