Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 491-494

  Jee, Young Kun ^a   Xia, Yang Hua ^a   Yu, Jin ^a   Kang, Hyun Woo ^a   Lee, Taek Young ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hanbat National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ARSENIC COMPOUNDS; BRAZING; COMPUTER NETWORKS; CONCENTRATION (PROCESS); COPPER; ELECTROLESS PLATING; INTERMETALLICS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; WELDING;

AL CONCENTRATIONS; INTERFACIAL REACTIONS;

TIN;

EID: 51349095281     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550017     Document Type: Conference Paper

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