Adhesive wafer bonding

Journal of Applied Physics

Volumn 99, Issue 3, 2006, Pages

  Niklaus, F ^a,b   Stemme, G ^a   Lu, J Q ^b   Gutmann, R J ^b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; BONDING TEMPERATURES; CIRCUIT WAFER PROCESSING; MICROFLUIDICS;

ADHESIVES; ELECTRONICS PACKAGING; FLUIDICS; INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; SURFACE TOPOGRAPHY;

BONDING;

EID: 33645536175     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2168512     Document Type: Review

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