Investigation of the Hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 677-680

  Jourdain, A ^a   De Moor, P ^a   Pamidighantam, S ^a   Tilmans, H A C ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BOLOMETERS; BONDING; BUTENES; FLIP CHIP DEVICES; FLUOROCARBONS; HELIUM; HERMETIC SEALS; LEAK DETECTION; SPIN COATING;

HERMETICITY; INDENT REFLOW SEALING; MICROBOLOMETERS;

MICROELECTROMECHANICAL DEVICES;

EID: 0036120530     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Low temperature full wafer adhesive bonding of structured wafers
2. 3D MEMS fabrication using low-temperature wafer bonding with bencocyclobutene (BCB)
3. Use of BCB in high-frequency MCM interconnects
4. Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab
5. New method for testing hermeticity of silicon sensor structures
6. Process development of fast and sensitive polySiGe microbolometers arrays
7. Metal and polySi(Ge) micromechanical devices for high frequency applications
8. The indent reflow sealing (IRS) technique - a method for the fabrication of sealed cavities for MEMS devices