SCOPUS 정보 검색 플랫폼

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3289, Issue , 1998, Pages 52-59

Assembly and packaging of liquid-crystal-on-silicon displays

(4) Kazlas, Peter T a Johnson, Kristina M a Lee, Yung Cheng a Hareb, Saeed a

a UNIVERSITY OF COLORADO (United States)

Author keywords

Assembly; Miniature liquid crystal on silicon displays; Packaging; Solder reflow; Spatial light modulators

Indexed keywords

ASSEMBLY; COMPUTER SIMULATION; ELECTRONICS PACKAGING; INTEGRATED OPTOELECTRONICS; INTERFEROMETRY; LIGHT MODULATION; SEMICONDUCTING SILICON; SUBSTRATES; THERMAL EXPANSION; THICKNESS MEASUREMENT;

CELL GAPS; COEFFICIENT OF THERMAL EXPANSION; LIQUID CRYSTAL ON SILICON DISPLAYS; PACKAGING CHRONOLOGY; SPATIAL LIGHT MODULATOR ASSEMBLY; SUBSTRATE FLATNESS; WAFER SCALE DISPLAY ASSEMBLY;

LIQUID CRYSTAL DISPLAYS;

EID: 0032225526 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.305491 Document Type: Conference Paper

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.