Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging

Journal of Microelectromechanical Systems

Volumn 9, Issue 1, 2000, Pages 3-8

  Cheng, Y T ^a   Lin, Liwei ^b   Najafi, Khalil ^a  

^a University of Michigan   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; BOND STRENGTH (MATERIALS); BONDING; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; HEATING; PHOSPHORUS; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES; TEMPERATURE;

EUTECTIC BONDING; GOLD FILMS; PHOSPHORUS DOPED POLYSILICON; SILICON FUSION;

MICROELECTROMECHANICAL DEVICES;

EID: 0033904174     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.825770     Document Type: Article

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