CMP compatibility of partially cured benzocyclobutene (BCB) for a via-first 3D IC process

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 63-68

  McMahon, J J ^a   Niklaus, F ^a   Kumar, R J ^a   Yu, J ^a   Lu, J Q ^a   Gutmann, R J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CROSSLINKING; ELECTRIC PROPERTIES; INTEGRATED CIRCUITS; SILICON WAFERS;

BASELINE PROCESS PARAMETERS; BENZOCYCLOBUTENE (BCB); BONDING STRENGTH;

AROMATIC HYDROCARBONS;

EID: 30544440375     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-867-w4.4     Document Type: Conference Paper

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