Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Journal of Micromechanics and Microengineering

Volumn 15, Issue 7, 2005, Pages

  Jourdain, A ^a   De Moor, P ^a   Baert, K ^a   De Wolf, I ^a   Tilmans, H A C ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; CHEMICAL BONDS; COMPUTATIONAL GEOMETRY; MICROWAVES; SHEAR STRENGTH; THERMAL EFFECTS; WAVEGUIDES;

BONDING CONDITIONS; CAPPING CHIPS; CAPPING MATERIALS; GEOMETRICAL PARAMETERS;

MICROELECTROMECHANICAL DEVICES;

EID: 21044455665     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/7/013     Document Type: Article

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