High-resolution patterning and transfer of thin PDMS films: FABRICATION of hybrid self-sealing 3D microfluidic systems

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 745-748

  Kloter, U ^a   Schmid, H ^a   Wolf, H ^a   Michel, B ^a   Juncker, D ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CROSSLINKING; ENCAPSULATION; FLUIDIC DEVICES; FREE ENERGY; INTERFACIAL ENERGY; MEMBRANES; MICROMACHINING; SOLUTIONS; THIN FILMS; VISCOSITY;

PATTERNING AND TRANSFER METHOD; SELF-SEALING PROPERTY; SUBSTRATE ELASTICITY; TOPOGRAPHY;

ELASTOMERS;

EID: 3042696939     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Juncker, D. et al. Autonomous Microfluidic Capillary System, Anal. Chem. 74, 6139-6144 (2002).
2. Kipphan, H., Handbuch der Printmedien, Springer, Berlin, Germany, 2000.
3. Whitesides, G. et al., Soft Lithography in Biology and Biochemistry, Annu. Rev. Biomed. Eng. 3, 335-373 (2001).
4. A. Cameron, Basic Lubrication Theory, p. 144, Ellis Horwood Ltd., Chichester, UK, 1981.
5. Anderson, J. et al. Fabrication of Topologically Complex Three-Dimensional Microfluidic Systems in PDMS by Rapid Prototyping. Anal. Chem. 72, 3158-3164 (2001).
6. Juncker, D. et al. Soft and Rigid Two-Level Microfluidic Networks for Patterning Surfaces, J. Micromech. Microeng. 11, 532-541 (2001).
7. Ryu, K. et al., Precision Patterning of PDMS Thin Films. A New Fabrication Method and Its Applications, Proc. Micro Total Analysis Systems 2002 Conf, Nara, Japan, pp. 112-114.
8. Schmid, H. et al., Preparation of Metallic Films on Elastomeric Stamps and Their Application for Contact Processing and Contact Printing., Adv. Funct. Mater. 2, 145-153 (2003).
9. Childs, W. & Nuzzo, R. Decal Transfer Microlithography: A New Soft-Lithographic Patterning Method, J. Am. Chem. Soc. 124, 13583-13596 (2002).
10. Genolet, G. New Photoplastic Fabrication Technique and Devices Based on High Aspect Ratio Photoresist, pp. 10-14, PhD Thesis, EPFL, Lausanne, Switzerland, 2001.
11. Despont, M. et al., Wafer-Scale Microdevice Transfer/ Interconnect: From a New Integration Method to Its Application in an AFM-Based Data-Storage System, Digest Transducers '03, Boston, MA, pp. 1907-1910.