Integrated sensor wafer-level packaging

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 287-289

  Audet, Sarah A ^a   Edenfeld, Katrina M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON SENSORS; SILICON WAFERS;

WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 0030651454     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)