Silicon layer transfer using wafer bonding and debonding

Journal of Electronic Materials

Volumn 30, Issue 7, 2001, Pages 841-844

  Colinge, Cynthia ^a   Roberds, Brian ^b   Doyle, Brian ^b  

^a CALIFORNIA STATE UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Polymer; Si layer transfer; Wafer bonding

Indexed keywords

ANNEALING; BONDING; HYDROFLUORIC ACID; ION IMPLANTATION; NITRIDES; POLYMERS; STIFFNESS; SURFACE ROUGHNESS; TEMPERATURE;

PLANARIZATION; SILICON LAYER TRANSFER; SILICON ON INSULATOR WAFER; TETRAETHOXYSILANE; TETRAMETHYLAMMONIUM HYDROXIDE; WAFER BONDING;

SILICON WAFERS;

EID: 0035391930     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0068-1     Document Type: Article

References (8)