Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities

Sensors and Actuators, A: Physical

Volumn 105, Issue 3, 2003, Pages 297-304

  Oberhammer, J ^a   Niklaus, F ^a   Stemme, G ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Adhesive bonding; BCB; Helium leak tests; Selective bonding; Wafer level encapsulation

Indexed keywords

ADHESIVES; BUTENES; ENCAPSULATION; HELIUM; MICROMACHINING; PHOTOSENSITIVITY; POLYMERIZATION; SURFACE PHENOMENA;

ADHESIVE BONDING;

BONDING;

EID: 0041431012     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00202-4     Document Type: Article

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