High-resolution long-array thermal ink jet printhead fabricated by anisotropic wet etching and deep Si RIE

Journal of Microelectromechanical Systems

Volumn 13, Issue 5, 2004, Pages 814-821

  Nayve, Regan ^a   Fujii, Masahiko ^a   Fukugawa, Atsushi ^a   Takeuchi, Takayuki ^a   Murata, Michiaki ^a   Yamada, Yusuke ^b   Koyanagi, Mitsumasa ^b  

^a FUJI XEROX CO LTD   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BONDING; ELECTROSTATICS; INDUCTIVELY COUPLED PLASMA; PRINTERS (COMPUTER); REACTIVE ION ETCHING; SILICON WAFERS; THERMAL EXPANSION;

DROP EJECTOR; ELECTROSTATIC BONDING; THERMAL INK JET PRINTHEAD;

MICROELECTROMECHANICAL DEVICES;

EID: 7244247476     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.835785     Document Type: Article

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