Sealing of adhesive bonded devices on wafer level

Sensors and Actuators, A: Physical

Volumn 110, Issue 1-3, 2004, Pages 407-412

  Oberhammer, Joachim ^a   Niklaus, Frank ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Adhesive bonding; Benzocyclobutene; Hermetic sealing; Wafer level encapsulation

Indexed keywords

ADHESIVES; CHEMICAL VAPOR DEPOSITION; DEPOSITION; ELECTRIC POTENTIAL; ETCHING; HERMETIC DEVICES; INTERCONNECTION NETWORKS; MICROELECTROMECHANICAL DEVICES; SEALING (CLOSING); SILICON NITRIDE;

ADHESIVE BONDING; ANODIC BONDING; WAFER-LEVEL ENCAPSULATION;

SILICON WAFERS;

EID: 1642566508     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.06.003     Document Type: Conference Paper

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