SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 27-32

Dielectric glue wafer bonding for 3D ICs

(6) Kwon, Y a Jindal, A a McMahon, J J a Lu, J Q a Gutmann, R J a Cale, T S a

a RENSSELAER POLYTECHNIC INSTITUTE (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; BOND STRENGTH (MATERIALS); BONDING; COPPER; ELECTRIC PROPERTIES; FILM PREPARATION; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; METALLIZING; THICKNESS MEASUREMENT;

BENZOCYCLOBUTENE GLUE; FOUR POINT BENDING; GLUE FILM PREPARATION;

SILICON WAFERS;

EID: 0348199188 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-766-e5.8 Document Type: Conference Paper

Times cited : (23)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.