Area-selective adhesive bonding using photosensitive BCB for WL CSP applications

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 7-11

  Polyakov, A ^a   Bartek, M ^a   Burghartz, J N ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; BONDING; CHARACTERIZATION; CHIP SCALE PACKAGES; ELASTIC MODULI; ETCHING; FRACTURE TOUGHNESS; MICROFILTRATION; WSI CIRCUITS;

BONDING PROCEDURE; LOW-COST PACKAGING; MIXED MODE FAILURE; WEDGE-OPENING;

ADHESIVES;

EID: 18744390791     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1846059     Document Type: Article

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