Reversible wafer-level bonding at room temperature

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 924-927

  Zhang, Wen Yue ^a   Labukas, Joseph P ^b   Tatic Lucic, Svetlana ^a   Ferguson, Gregory S ^b  

^a Lehigh University   (United States)

^b LEHIGH UNIVERSITY   (United States)

Author keywords

Electrochemical reduction; Reversible bonding; Self assembled monolayer; Tensile test; Thermal decomposition; Wafer level packaging

Indexed keywords

BONDING; ELASTOMERS; ELECTROCHEMISTRY; MICROELECTROMECHANICAL DEVICES; PYROLYSIS; SELF ASSEMBLY; TEMPERATURE DISTRIBUTION; TENSILE TESTING;

ELECTROCHEMICAL REDUCTION; REVERSIBLE BONDING; TENSILE TEST; WAFER-LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 27544444629     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. W.-Y. Zhang, G. S. Ferguson, S. Tatic-Lucic; "Elastomer-Support Cold-Welding For Room-Temperature Wafer-Level Bonding", in Tech. Dig, of 17th IEEE Intl. Conf. on Micro Electro Mechanical Syst., MEMS2004, (Maastricht, The Netherlands, January 25-29, 2004), pp 741-744.
2. W.-Y. Zhang, J. P. Labukas, S. Tatic-Lucic, L. Larson, T. Bannuru, and G. S. Ferguson; "Novel Room-Temperature First-Level Packaging Process for Microscale Devices", in Proc. of Eurosensors XVIII, Rome, Italy, September 13-15, 2004, pp. 552-3.
3. C. Kim, M. Shtein, S. R. Forrest, "Nanolithography based on patterned metal transfer and its application to organic electronic devices", Appl. Phys. Lett., vol. 80, no. 21, pp. 4051-4053, 2002.
4. Y. Park, Y. C. Kim, B. C. Shim, and J. H. Hahn, "Strong Bonding of Metal Thin-Film Micro-patterns on PDMS Plate Using Self-Assembled Monolayers", in Proc. of Micro Total Analysis System 2002, Y. Baba et al. (eds.). vol. 1, pp. 416-418.
5. R. N. Candler, W.-T. Park, H. Li., G. Yama, A. Partridge, M. Lutz, T. W. Kenny, "Single wafer encapsulation of MEMS devices", IEEE Trans. Adv. Packag., vol. 26, no. 3, pp 227-32. August 2003.
6. Y.-I. Lee, K.-H. Park, J. Lee, C.-S. Lee, H. J. Yoo, CJ Kim, Y.-S. Yoon, "Dry Release for Surface Micromachining with HF Vapor-Phase Etching", J. Microelectromech. Syst., vol. 6, no. 3, pp. 226-233, September 1997.
7. G. M. Kim, B. Kim, M. Liebau, J. Huskens, D. N. Reinhoudt, J. Brugger, "Surface Modification with Self-Assembled Monolayers for Nanoscale Replication of Photoplastic MEMS", J. Microelectromech. Syst., vol. 11, no. 3, pp. 175-181, June 2002.
8. U. Srinivasan, M. R. Houston, R. T. Howe, R. Maboudian, "Alkyltrichlorosilane-Based Self-Assembled Monolayer Films for Stiction Reduction in Silicon Micromachines", J. Microelectromechan. Syst., vol. 7, no. 2, pp 252-260, June 1998.
9. H. Schmid, H. Wolf, R. Allenspach, H. Riel, S. Karg, B. Michel, E. Delamarche, "Preparation of Metallic Films on Elastomeric Stamps and Their Application for Contact Processing and Contact Printing", Adv. Fund. Mater, vol. 13, no. 2, February 2003.
10. J. M. Jemmings and L. M. Phinney, "The Effects of Temperature on Surface Adhesion in MEMS Structures", Proc. SPIE, vol. 4180, pp. 66-75, 2000,
11. C. A. Widrig, C. Chung, M. D. Porter, "The Electro-chemical Desorption of n-Alkanethiol Monolayers from Polycrystalline Au and Ag Electrodes", J. Electroanal. Chem. vol. 310, pp. 335-359, 1991.