Wafer-level packaging technology for MEMS

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 113-119

  Mirza, A R ^a  

^a Electronic Visions Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; MICROMACHINING; SILICON SENSORS; SILICON WAFERS; THERMAL STRESS; THIN FILMS;

ANISOTROPIC WET ETCHING; POLYSILICON; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0033709376     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)