Microgasketing and room temperature wafer joining for liquid-filled MEMS devices

American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) DSC

Volumn 62, Issue , 1997, Pages 29-34

  Simon, Jonathan ^a   Huang, Long Sun ^a   Sridharan, Balaji ^a   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GASKETS; LITHOGRAPHY; PLASTIC ADHESIVES;

MICROGASKETING;

MICROELECTROMECHANICAL DEVICES;

EID: 0031387108     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)

1. Redwood MicroSystems, Inc., 959 Hamilton Avenue, Menlo Park, CA 94025.
2. J. Simon, S. Saffer, and C.-J. Kim, "A Micromechanical Relay with a Thermally-Driven Mercury Micro-Drop," Proc. IEEE Micro Electro Mechanical Systems Workshop, San Diego, CA, Feb. 1996, pp. 515-520.
3. B. Shivkumar and C.-J. Kim, "Microriveting- A New Wafer Joining Method," Proc. IEEE Micro Electro Mechanical Systems Workshop, Nagoya, Japan, Jan. 1997, pp. 197-202.
4. D. Maas, B. Bustgens, J. Fahrenberge, and W. Keller, "Fabrication of Micro-Components Using Adhesive Bonding Techniques," Proc. IEEE Micro Electro Mechanical Systems Workshop, San Diego, CA, Feb. 1996, pp. 331-336.
5. Norland Products, Inc. 695 Joyce Kilmer Ave, New Brunswick, NJ 08902.
6. Dymax Corporation, 51 Greenwoods Road, Torrington, CT.
7. K. Dieu, "Fabrication and Testing of Electroplated Microchannels and Application for IC Chip Cooling," M.S. Thesis, Mechanical and Aerospace Engineering Department, University of California, Los Angeles, 1995.