Fabrication of a microfluidic chip by UV bonding at room temperature for integration of temperature-sensitive layers

Journal of Micromechanics and Microengineering

Volumn 13, Issue 4, 2003, Pages

  Schlautmann, S ^a   Besselink, G A J ^a   Prabhu G, Radhakrishna ^a   Schasfoort, R B M ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

GLUES; SURFACE PLASMON RESONANCE; ULTRAVIOLET RADIATION;

MICROFLUIDIC CHIPS;

FLUIDIC DEVICES;

EID: 0038441783     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/4/313     Document Type: Conference Paper

References (7)

1. Ramsey J M and van den Berg A 2001 Micro Total Analysis Systems (Dordrecht: Kluwer)
2. Kopf-Sill A R 2000 Commercializing lab-on-chip technology Proc. Micro Total Analysis 2000 (μTAS 2000) (Enschede, The Netherlands) pp 233-8
3. Schlautmann S, Wensink H, Schasfoort R B M, Elwenspoek M C and van den Berg A 2001 Powder-blasting technology as an alternative tool for micro-fabrication of CE-chips with integrated conductivity sensors J. Micromech. Microeng. 11 386-9
4. Huang Z, Sanders J C, Dunsmor C, Ahmadzadeh H and Landers J P 2001 A method for UV-bonding in the fabrication of glass electrophoretic microchips Electrophoresis 22 3924-9
5. Niklaus F, Enoksson P, Kälvesten E and Stemme G 2000 Void-free full wafer adhesive bonding 13th Int. Workshop on Micro Electro Mechanical Systems (MEMS 2000) (Miyazaki, Japan) pp 247-52
6. Wensink H, Berenschot J W, Jansen H V and Elwenspoek M C 2000 High resolution powder blast micromachining 13th Int. Workshop on Micro Electro Mechanical Systems (MEMS 2000) (Miyazaki, Japan) pp 769-74
7. van der Linden H, Olthuis W and Bergveld P 2001 Selective adhesive bonding of a CE chip with UV-curable glue Nanotech 2001 (Montreux, Switzerland)