Stamp-and-stick room-temperature bonding technique for microdevices

Journal of Microelectromechanical Systems

Volumn 14, Issue 2, 2005, Pages 392-399

  Satyanarayana, Srinath ^a   Karnik, Rohit N ^a   Majumdar, Arunava ^a,b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

Microelectromechanical systems (MEMS); Microfluidics; Poly(dimethylsiloxane) (PDMS); Room temperature; Transfer bonding; Ultraviolet (UV) curable adhesive

Indexed keywords

ADHESIVES; BONDING; FABRICATION; GLASS; NITRIDES; SILICON;

MICROFLUIDICS; POLYDIMETHYLSILOXANE (PDMS); STAMP-AND-STICK ROOM TEMPERATURE; TRANSFER BONDING; ULTRAVIOLET (UV) CURABLE ADHESIVE;

MICROELECTROMECHANICAL DEVICES;

EID: 18844442297     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.839334     Document Type: Article

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