SCOPUS 정보 검색 플랫폼

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 63-66

Chip scale packaging techniques for RF SAW devices

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE FILTERS; ADHESIVES; BONDING; CERAMIC MATERIALS; ETCHING; LITHIUM COMPOUNDS; MECHANICAL TESTING; PORTABLE EQUIPMENT; RELIABILITY; SILICON WAFERS; SUBSTRATES;

LITHIUM TANTALATE; PORTABLE ELECTRONIC PRODUCT; RADIO FREQUENCY SURFACE ACOUSTIC WAVE DEVICE; WAFER-LEVEL PROCESSING;

CHIP SCALE PACKAGES;

EID: 0036403012 PISSN: 10898190 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (26)

References (7)

1
- 6744247095
- Wafer-level packaging has arrived
- Oct.
- P. Garrou, "Wafer-Level Packaging Has Arrived", Semiconductor International, Oct. 2000.
- (2000) Semiconductor International
- Garrou, P.¹

2
- 48149098360
- SAW device assembly technology
- H. Yatsuda, "SAW Device Assembly Technology", Intl. Symp. On Acoustic Wave Devices for Future Mobile Communications Systems, Mar. 5-7, 2001, pp. 189-194.
- Intl. Symp. on Acoustic Wave Devices for Future Mobile Communications Systems, Mar. 5-7, 2001 , pp. 189-194
- Yatsuda, H.¹

3
- 0033296691
- Impact of SAW device passivation on RF performance
- B.W. Marks, D.W. Sheddrick and S. Jen, "Impact of SAW Device Passivation on RF Performance", IEEE Ultrason. Symp. Proc. 1999.
- IEEE Ultrason. Symp. Proc. 1999
- Marks, B.W.¹ Sheddrick, D.W.² Jen, S.³

4
- 0029545253
- A two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMICs
- T. Kaleta, C. Varmazis, P. Chinoy, J. P. Carney, N. Jansen and M. Loboda, "A two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMICs", Gallium Arsenide Integrated Circuit (GaAsIC) Symposium, Technical Digest 1995, 17th Annual IEEE, 1995, pp. 128-131.
- Gallium Arsenide Integrated Circuit (GaAsIC) Symposium, Technical Digest 1995, 17th Annual IEEE, 1995 , pp. 128-131
- Kaleta, T.¹ Varmazis, C.² Chinoy, P.³ Carney, J.P.⁴ Jansen, N.⁵ Loboda, M.⁶

5
- 0035303657
- Miniaturization and advanced functionalities of SAW devices
- April
- H. Meier, T. Baier and G. Riha, "Miniaturization and Advanced Functionalities of SAW Devices", Microwave Theory and Techniques, IEEE Transactions, Volume: 49 Issue: 4 Part: 2, April pp. 743-748.
- (2001) Microwave Theory and Techniques, IEEE Transactions , vol.49 , Issue.4 PART 2 , pp. 743-748
- Meier, H.¹ Baier, T.² Riha, G.³

6
- 0036120530
- Investigation of the hermeticity of BCB-sealed cavities for housing (RF)-MEMS devices
- A. Jourdain, P. De Moor, S. Pamidighantam and H. A. C. Tilmans, "Investigation of the Hermeticity of BCB-Sealed Cavities for Housing (RF)-MEMS Devices", Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference, 2002, pp. 677-680.
- Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference, 2002 , pp. 677-680
- Jourdain, A.¹ De Moor, P.² Pamidighantam, S.³ Tilmans, H.A.C.⁴

7
- 0142141828
- Preconditioning of nonhermetic surface mount devices prior to reliability testing
- IEA/JEDEC STANDARD JESD22-A113-B; March
- IEA/JEDEC STANDARD JESD22-A113-B, "Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing", March 1999.
- (1999)

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