Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays

Journal of Micromechanics and Microengineering

Volumn 11, Issue 5, 2001, Pages 509-513

  Niklaus, F ^a   Kalvesten E ^a   Stemme, G ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; INFRARED DEVICES; LOW TEMPERATURE OPERATIONS; POLYSILICON; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SUBSTRATES; TRANSDUCERS;

FREE-HANGING TRANSDUCERS; INFRARED FOCAL PLANE ARRAYS; MEMBRANE TRANSFER BONDING;

BOLOMETERS;

EID: 0035444094     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/5/310     Document Type: Article

References (16)

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15. Three-dimensional integration technology for real time micro-vision system
16. Processing, characterisation and optimization of detector structures intended for uncooled microbolometer arrays