Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1832-1835

  Oberhammer, J ^a   Stemme, G ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Encapsulation; Glass; Microelectromechanical devices; Micromachining; Micromechanical devices; Packaging; Surface contamination; Wafer bonding; Wafer scale integration; Wet etching

Indexed keywords

ACTUATORS; COMPOSITE MICROMECHANICS; ELECTRONICS PACKAGING; ENCAPSULATION; GLASS; GLASS BONDING; HYDROFLUORIC ACID; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSYSTEMS; PACKAGING; SOLID-STATE SENSORS; SURFACE MICROMACHINING; TRANSDUCERS; WET ETCHING; WSI CIRCUITS;

ADHESIVE WAFER BONDING; ELECTRICAL INTERCONNECTIONS; FABRICATION TECHNIQUE; HERMETIC PACKAGING; MICROMECHANICAL DEVICE; SURFACE CONTAMINATIONS; SURFACE MICROMACHINING PROCESS; THROUGH-WAFER VIAS;

WAFER BONDING;

EID: 84944728850     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217144     Document Type: Conference Paper

References (10)

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