Ultrathin wafer level chip size package

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 212-214

  Badihi, Avner ^a  

^a Shellcase Ltd   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ENCAPSULATION; GLASS; INTEGRATED CIRCUIT MANUFACTURE; POLYMERS; SEMICONDUCTOR DEVICES; SILICON WAFERS; STANDARDS;

BUMPS; GLASS ENCAPSULATION; SEMICONDUCTOR WAFER PROCESSING EQUIPMENT; SOLID DIE SIZE GLASS SHELL; WAFER LEVEL CHIP SIZE PACKAGE;

ELECTRONICS PACKAGING;

EID: 0033718947     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846636     Document Type: Article

References (7)

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3. A. Bahdi et al., "Shellcase-A true miniature integrated circuit package," in Proc. Int. Flip Chip, BGA Symp., San José, ÇA, 1995, p. 244.
4. G. Czornyj, M. Asano, P. Beliveau, P. Garrou, H. Hiramoto, A. Ikeda, J. Kreuz, and O. Rhode, "Polymers in packaging," in Microelectronic Packaging Handbook-Part II: Semiconductor Packaging, R. Tummala, G. Rymaszewski, and A. Klopfenstein, Eds. New York: Chapman & Hall, 1997, ch. 11.
5. P. E. Garrou, "MCM-D: Thin film materials, processes and applications," in Multichip Module Handbook, P. Garrou and I. Turlk, Eds. New York: McGraw Hill, 1997, ch. 3.
6. A. Bahdi et al., "A CSP optioelectronic package for imaging and light detecton applications," in Proc. IMAPS Conf., Tel Aviv, Israel, 1998, p. 18.
7. N. Pulsford, M. de Samber, and M. VanDelden, "Integrated passive components and chip scale packaging," in Proc. IEEE Workshop VLSI, Brugge, Belgium, May 1999.