Encapsulation of film bulk acoustic resonator filters using a wafer-level microcap array

Journal of Micromechanics and Microengineering

Volumn 15, Issue 8, 2005, Pages 1433-1438

  Lin, Chung Hsien ^a   Lu, Ju Mei ^b   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b ASIA PACIFIC MICROSYSTEMS INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; BANDWIDTH; COMMUNICATION SYSTEMS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; ENCAPSULATION; OPTICAL FILTERS; OPTICAL RESONATORS; SILICON WAFERS; THIN FILMS; TRANSMITTERS;

CAVITY ETCHING; FILM BULK ACOUSTIC RESONATOR FILTERS (FBAR); PERSONAL COMMUNICATION SYSTEMS (PCS); WAFER-LEVEL MICROCAP ARRAYS;

ACOUSTIC BULK WAVE DEVICES;

EID: 22544471881     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/8/008     Document Type: Article

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