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Volumn 812, Issue , 2004, Pages 321-326
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Evaluation of thin dielectric-glue wafer-bonding for three dimensional integrated circuit-applications
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
DISSOCIATION;
GLUES;
INTEGRATED CIRCUITS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SILICA;
SILICON NITRIDE;
SILICON WAFERS;
SULFURIC ACID;
TENSILE STRESS;
THERMAL CYCLING;
THERMAL EXPANSION;
THREE DIMENSIONAL;
ADHESION ENERGY;
BENZOCYCLOBUTENE (BCB);
GLASS WAFERS;
WAFER LEVEL THREE-DIMENSIONAL (3D) INTEGRATION;
DIELECTRIC MATERIALS;
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EID: 12844250613
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-812-f6.16 Document Type: Conference Paper |
Times cited : (9)
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References (13)
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