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Volumn 812, Issue , 2004, Pages 321-326

Evaluation of thin dielectric-glue wafer-bonding for three dimensional integrated circuit-applications

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DISSOCIATION; GLUES; INTEGRATED CIRCUITS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICA; SILICON NITRIDE; SILICON WAFERS; SULFURIC ACID; TENSILE STRESS; THERMAL CYCLING; THERMAL EXPANSION; THREE DIMENSIONAL;

EID: 12844250613     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-812-f6.16     Document Type: Conference Paper
Times cited : (9)

References (13)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.