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Volumn 1, Issue , 2005, Pages 940-943
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Film transfer and bonding technique to cover Lab on a Chip
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Author keywords
Capillary flow; Film Transfer; Room temperature bonding
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Indexed keywords
FILM TRANSFER;
MICROFLUIDIC SYSTEMS;
ROOM TEMPERATURE BONDING;
SILICON CHIP;
BONDING;
CAPILLARY FLOW;
FLUID DYNAMICS;
SURFACE TENSION;
TEMPERATURE DISTRIBUTION;
THIN FILMS;
MICROPROCESSOR CHIPS;
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EID: 27544444627
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (10)
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References (7)
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