Effects of temperatures on microstructures and bonding strengths of Si-Si bonding using bisbenzocyclobutene

Sensors and Actuators, A: Physical

Volumn 108, Issue 1-3, 2003, Pages 201-205

  Choi, Yeon Shik ^a   Park, Joon Shik ^a,c   Park, Hyo Derk ^a   Song, Young Hwa ^b   Jung, Jin Soo ^b   Kang, Sung Goon ^c  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

^b DS Precision Engineering   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Bisbenzocyclobutene; Polymer bonding; Thermal stability; Wafer bonding

Indexed keywords

BOND STRENGTH (CHEMICAL); CHEMICAL BONDS; ETCHING; GLASS TRANSITION; INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; TENSILE STRENGTH; THERMAL EFFECTS; THERMODYNAMIC STABILITY;

DICING PROCESS;

SILICON WAFERS;

EID: 0345376745     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00375-3     Document Type: Conference Paper

References (5)

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