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Volumn 5406, Issue PART 2, 2004, Pages 521-530

Characterization of transfer bonded silicon bolometer arrays

Author keywords

CMOS compatible; Polycrystalline silicon bolometer; Transfer bonding; Uncooled FPA

Indexed keywords

CAVITY RESONATORS; CMOS INTEGRATED CIRCUITS; COST EFFECTIVENESS; HIGH TEMPERATURE EFFECTS; INFRARED DETECTORS; INTEGRATED CIRCUITS; MICROELECTRONIC PROCESSING; POLYSILICON;

EID: 10044228537     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.565894     Document Type: Conference Paper
Times cited : (32)

References (14)
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  • 10
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    • F. Niklaus, "Adhesive wafer bonding for microelectronic and microelectromechanical systems", Ph.D. Thesis, Microsystem Technology, Department of Signals, Sensors and Systems (S3), Royal Institute of Technology (KTH), Stockholm, Sweden, 2002.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.