One micron precision, wafer-level aligned bonding for interconnect, MEMS and packaging applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 676-680

  Mirza, A R ^a  

^a Electronic Visions Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; ELECTRONICS PACKAGING; INFRARED RADIATION; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES;

CHIP SCALE; MICRON ALIGNMENT; PRECISION ALIGNMENT POSITIONING SYSTEMS; SUBSTRATE TO SUBSTRATE ALIGNMENT TECHNIQUES; WAFER LEVEL ALIGNED BONDING;

SILICON WAFERS;

EID: 0034484432     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)