Localized plastic bonding for micro assembly, packaging and liquid encapsulation

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2001, Pages 50-53

  Su, Y C ^a   Lin, L ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; GLASS TRANSITION; HEATING; INTERFACES (MATERIALS); PLASTIC FILMS; POLYMERS; PRESSURE EFFECTS; SEMICONDUCTING SILICON; THERMAL EFFECTS; THERMOPLASTICS; THIN FILMS;

LOCALIZED PLASTIC BONDING;

BONDING;

EID: 0035018041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)