Wafer bonding using microwave heating of parylene for MEMS packaging

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 924-930

  Noh, Hong Seok ^a   Moon, Kyoung Sik ^b   Cannon, Andrew ^a   Hesketh, Peter J ^a   Wong, C P ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BONDING; ELECTRIC POTENTIAL; EUTECTICS; HEATING; MICROWAVES; POLYMERS; SOLVENTS;

PARYLENE; SOLVENT RELEASE; SPIN-COATED AMORPHOUS POLYMERS; WAFER BONDING;

WSI CIRCUITS;

EID: 10444279142     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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