A low temperature wafer-level hermetic MEMS package using UV curable adhesive

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1486-1491

  Liang, Zhi Hao ^a   Cheng, Y T ^a   Hsu, W ^a   Lee, Yuh Wen ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COSTS; HEATING; INFRARED DETECTORS; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; NETWORKS (CIRCUITS);

DICING; DIE SEPARATION; MONITORING DEVICES; SACRIFICIAL LAYERS;

ELECTRONICS PACKAGING;

EID: 10444245849     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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