Batch micropackaging by compression-bonded wafer-wafer transfer

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 482-489

  Maharbiz, Michel M ^a   Cohn, Michael B ^a   Howe, Roger T ^a   Horowitz, Roberto ^a   Pisano, Albert P ^a  

^a Microassembly Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; RESONATORS; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS;

BATCH MICROPACKAGING; POLYSILICON RESONATORS; WAFER-WAFER TRANSFER;

MICROELECTROMECHANICAL DEVICES;

EID: 0032635178     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/memsys.1999.746876     Document Type: Conference Paper

References (24)