Packaging method for RF MEMS devices using LTCC capping substrate and BCB adhesive bonding

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 1092-1095

  Kim, Ki Il ^a   Kim, Jung Mu ^a   Kim, Jong Man ^a   Back, Chang Wook ^b   Kim, Yong Kweon ^a  

^a Seoul National University   (South Korea)

^b Chung Ang University   (South Korea)

Author keywords

BCB sealing rim; LTCC capping; Packaging; RF MEMS

Indexed keywords

ELECTRONICS PACKAGING; HOLE MOBILITY; ION IMPLANTATION; LEAKAGE CURRENTS; SEALING (CLOSING); SHEAR STRENGTH; SILVER;

BCB SEALING RING; CAPPING SUBSTRATES; LTCC SUBSTRATES; RF MEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 27544511498     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. th Int. conf. Solid-State Sensors, Actuators and Microsystems (Transducers '03), Boston, MA, 8-12 June, 2003, pp. 1915-1918.
2. th Int. conf. Solid-State Sensors, Actuators and Microsystems (Transducers '03), Boston, MA, 8-12 June, 2003, pp. 340-341.
3. R. M. Henderson and L. P. B. Katehi, "Silicon-Based Micromachined Packages for High-Frequency Application," IEEE Trans. Microwave Theory Tech., vol. 47, no. 8, pp. 1563-1569, 1999.
4. http://www.dow.com
5. Yeon-Shik Choi, Joon-Shik Park, Hyo-Derk Park, Young-Hwa Song, Jin-Soo Jung and Sung-Goon Kang, "Effects of temperatures on microstructures and bonding strengths of Si-Si bonding using bisbenzocyclobutene," Sensors and Actuators A, vol. 108, pp 201-205, 2003.
6. Gabriel M. Rebeiz, RF MEMS Theory, Design, and Technology. Hoboken, NJ: John Wiley & Sons Inc., 2003.