Effects of softbake parameters on a benzocyclobutene (BCB) adhesive wafer bond

Materials Research Society Symposium - Proceedings

Volumn 782, Issue , 2003, Pages 187-192

  Pascual, Daniel N ^a  

^a SUSS MicroTec Lithography GmbH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CHEMICAL BONDS; CURING; FLIP CHIP DEVICES; INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; TOUGHNESS;

BENZOCYCLOBUTENE (BCB); INTERFACE TOUGHNESS; VOID FREE BONDS;

POLYMERS;

EID: 2942677287     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-782-a5.20     Document Type: Conference Paper

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