Damage Free Dicing Method for MEMS Devices

IEEJ Transactions on Sensors and Micromachines

Volumn 123, Issue 7, 2003, Pages 255-256

  Matsumoto, Yoshinori ^a   Awatani, Yoshio ^a   Kato, Kei ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

damage free; dicing; MEMS; thermocompression bonding; thermoplastic adhesive

Indexed keywords

EID: 84889006507     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.123.255     Document Type: Article

References (2)

1. R. Maboudian and R. T. Howe : “Critical Review :Adhesion in surface micromechanical structures”, J. Vac. Sci. TechnoLB 15(1), pp. 1-20 (1997)
2. Y. Matsumoto, A. Nakazono, T. Kitahara, and Y. Koike : “ High efficiency optical coupler for a small photo acceptance area photodiode used in the high speed plastic optical fiber communication”, Sensors and Actuators A, Vol. 97-98, pp. 318-322 (2002)