Wafer-level High Density Multifunctional Integration (HDMI) for low-cost micro/nano/electro-opto/bio heterogeneous systems

2003 Nanotechnology Conference and Trade Show - Nanotech 2003

Volumn 1, Issue , 2003, Pages 530-533

  Gutmann, R J ^a   Lu, J Q ^a   McMahon, J J ^a   Persans, P D ^a   Cale, T S ^a   Eisenbraun, E T ^b   Castracane, J ^b   Kaloyeros, A E ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

3D integration; Heterogeneous systems; High Density Multifunctional Integration (HDMI); System in a package (SiP); System on a chip (SoC)

Indexed keywords

3D INTEGRATION; HETEROGENEOUS SYSTEMS; HIGH DENSITY MULTIFUNCTIONAL INTEGRATION (HDMI); SYSTEM-IN-A-PACKAGE (SIP); SYSTEM-ON-A-CHIP (SOC);

ADHESION; CHEMICAL VAPOR DEPOSITION; ELECTROOPTICAL DEVICES; FLUIDICS; INDUCTIVELY COUPLED PLASMA; MICROOPTICS; MOLECULAR STRUCTURE; OPTICAL INTERCONNECTS; SCANNING ELECTRON MICROSCOPY; THIN FILMS;

WSI CIRCUITS;

EID: 2442442516     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. J.-Q. Lu, Y. Kwon, G. Rajagopalan, M. Gupta, J. McMahon, K.-W. Lee, R.P. Kraft, J. F. McDonald, T.S. Cale, R.J. Gutmann, B. Xu, E. Eisenbraun, J. Castracane, and A. Kaloyeros, in IEEE 2002 International Interconnect Technology Conference (IITC 2002), pp. 78-80, 2002.
2. P. Ramm, D. Bonfert, R. Ecke, F. Iberl, A. Klumpp, S. Riedel, S.E. Schulz, R. Wieland, M. Zacher, and T. Gessner, in Advanced Metallization Conference in 2001 (AMC 2001), pp. 159-165, 2001.
3. K.W. Lee, T. Nakamura, T. One, Y. Yamada, T. Mizukusa, H. Hasimoto, K.T. Park, H. Kurino, and M. Koyanagi, in Digest of 2000 International Electron Device Meeting, pp. 165-168, 2000.
4. A. Rahman, A. Fan, J. Chung, and R. Reif, in IITC 1999, pp. 233-235, 1999.
5. J.A. Davis, R. Venkatesan, A. Kaloyeros, M. Beylanksy, S.J. Souri, K. Banerjee, K.C. Saraswat, A. Rahman, R. Reif, and J.D. Meindl, Proc. IEEE, Vol. 89, No. 3, pp. 305-324, March 2001.
6. International Technology Roadmap for Semiconductors (ITRS): 2001 Edition.
7. Y. Kwon, J.-Q. Lu, R.J. Gutmann, R.P. Kraft, J.F. McDonald and T.S. Cale, in Sixth International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, at 2001 ECS/ISC, September 2001.
8. R.J. Gutmann, J.-Q. Lu, and T.S. Cale, in Proceedings of 2002 AVS Third International Conference on Microelectronics and Interfaces (ICMI'02), edited by C.T. Gabiel, pp. 23-26, 2002.
9. J.-Q. Lu, K.W. Lee, Y. Kwon, G. Rajagopalan, J. McMahon, B. Altemus, M. Gupta, E. Eisenbraun, B. Xu, A. Jindal, R.P. Kraft, J.F. McDonald, J. Castracane, T.S. Cale, A. Kaloyeros, and R.J. Gutmann, in AMC 2002, San Diego, CA, October 2002.
10. R.J. Gutmann, J.-Q. Lu, Y. Kwon, J.F. McDonald and T.S. Cale, in Proceedings of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 173-180, Potsdam, Germany, 2001.
11. H.A. Reed, M.S. Bakir, C.S. Patel, K.P. Martin, J.D. Meindl, P.A. Kohl, in IITC 1999, pp. 151-153, 1999.