BCB wafer bonding for microfluidics

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5342, Issue , 2004, Pages 182-191

  Hwang, Taejoo ^a   Popa, Dan ^a   Sin, Jeongsik ^a   Stephanou, Harry E ^a   Leonard, Eric M ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b EASTMAN KODAK COMPANY   (United States)

Author keywords

BCB bonding; Bulk micromachining; DRIE; MEMS packaging; Microchannel; Microfluidics; Photo etchable glass; Wafer bonding

Indexed keywords

ASPECT RATIO; BIOCOMPATIBILITY; CURING; DRY ETCHING; GLASS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; NITROGEN; PHOTOLITHOGRAPHY; POLYMERS; REACTIVE ION ETCHING; SENSITIVITY ANALYSIS; STRENGTH OF MATERIALS; VACUUM APPLICATIONS;

BCB BONDING; BULK MICROMACHINING; DRIE; MEMS PACKAGING; MICROCHANNELS; MICROFLUIDICS; PHOTO-ETCHABLE GLASS; WAFER BONDING;

SILICON WAFERS;

EID: 2142640503     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524621     Document Type: Conference Paper

References (25)

1. Marten Stjernstrom and Johan Roeraade, "Method for fabrication of microfluidic systems in glass", J. Micromech. Microeng., 8, pp 33-38, 1998
2. Thierry corman, Peter Enoksson, and Goran Stemme, "Deep wet etching of borosilicate glass using anodically bonded silicon substrate as mask", J. Micromech. Microeng., 8, pp 84-87, 1998
3. Jian Zhang and Thomas Haiqing Gong, "Micromachining Technologies for Capillary Electrophoresis Utilizing Pyrex Glass Etching and Bonding", Proceedings of the SPIE - The International Society for Optical Engineering, 4174, pp. 356-362, 2000
4. E. Obermeier, "Anodic wafer bonding", Electrochemical Society Proceedings, 95, no. 7, pp. 212-220, 1995
5. A.R. Mirza and A.A. Ayon, "Silicon wafer bonding: key to MEMS high-volume manufacturing", Sensors, 15, no. 12, pp. 24-30, 32-33, 1998
6. Shekhar Bhansali, Arum Han, et. al., "Resolving chemical/bio- compatibility issues in microfluidic MEMS systems", SPIE conference on Microfluidic Devices and Systems 2, 3877, pp. 101-108, 1999
7. Byung-Ho Jo, Linda M. Van Lerberghe, et. al., "Three-Dimensional Micro-Channel Fabrication in Polydimethylsiloxane (PDMS) Elastomer", J. of MEMS, 9, no. 1, 2000
8. Noo Li Jeon, Daniel T. Chiu, et. al., "Design and Fabrication of Integrated Passive Valves and Pumps for Flexible Polymer 3-Dimensional Microfluidic Systems", Biomedical Microdevices, 4, no.2, pp. 117-121, 2002
9. T. Matsumoto, M. Satoh, et. al., "New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method", Jpn. Journal of Applied Physics, 37, pp. 1217-1221, 1998
10. T.-K. Chou and K. Najafi, "3D MEMS Fabrication Using Low-Temperature Wafer Bonding With Benzocyclobutene (BCB)", Transducers 2001, Eurosensors XV, pp. 1570-1573, 2001
11. The Dow chemical website, http://www.dow.com/cyclotene/over/3000b.htm
12. M. J. Berry, P. Garrou, B. Rogers, and I. Turlik, "Soft Mask for Via Patterning in BCB Dielectric", Int. J. Microcircuits & Electronic Packaging, 17, pp. 210-218, 1994
13. The Dow chemical website, http://www.dow.com/cyclotene/prods/plasma.htm
14. A. Joudain, et. al., "Investigations of the hermeticity of BCB-sealed cavities for housing RF MEMS devices", Proc. MEMS 2002, pp. 677-680, Las Vegas, NV, 2002
15. C. Den Besten, R.E.G. van Hal, J. Munoz, and P. Bergveld, "Polymer bonding of micro-machined silicon structures", Proceedings. IEEE Micro Electro Mechanical Systems., An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots, IEEE, xv+237, pp. 104-109., New York, NY, USA, 1992
16. F. Niklaus, H. Andersson, et. al., "Low temperature full wafer adhesive bonding of structured wafers", Sensors and Actuators, A92, pp. 235-241, 2001
17. Rebecca J Jackman, Tamara M Floyd, et. al., "Microfluidic systems with on-line UV detection fabricated in photodefinable epoxy", J. of Micromech. & Microeng., 11, pp. 1-8, 2001
18. Taejoo Hwang, Dan Popa, et. al., "BCB wafer Bonding Compatible with Bulk Micromaching", Proceedings of International electronic Packaging Technical Conference and Exhibition 2003, no. 35032, 2003
19. T.R. Dietrich, W. Ehrfeld, M. Lacher, M. Krämer, B. Speit, "Fabrication technologies for microsystems utilizing photoetchable glass", Microelectronic Engineering, 30, pp. 497-504, 1996
20. S.D. Stookey, "Photosensitve glass," Industrial and Engineering Chemistry, 41, No. 4, pp. 856-861, 1949
21. A. Freitag, D. Vogel, R. Scholz, T.R. Dietrich, "Microfluidic devices Made of Glass", JALA, Journal of the Association for Laboratory Automation, 6, No. 4, pp. 45-49, 2001
22. F. Niklaus, P. Enoksson, E. Kalvesten, and G. Stemme, "Low-temperature full wafer adhesive bonding", Journal of Micromechanics and Microengineering, 11, no. 2, 2001
23. H. E. Bair and C. A. Pryde, "Curing & Glass Transition Behavior of a Benzocyclobutene Polymer", Proceedings Society of Plastics Engineers, ANTEC, pp. 1550, Montreal, 1991
24. R. J. Hohlfelder, D. A. Maidenberg, and R. H. Dauskardt, "Adhesion of Benzocyclobutene-passivated silicon in epoxy layered structures", J. Master. Res., 16, No. 1, pp. 243-255, 2001
25. J. M. Snodgrass, D. Pantelidis, M. L. Jenkins, J. C. Bravman, and R. H. Dauskardt, "Subcritical debonding of polymer/silica interfaces under monotonic and cyclic loading", Acta Materialia, 50, no. 9, pp. 2395-2411, 2002