Damage free dicing method for MEMS devices

2002 IEEE/LEOS International Conference on Optical MEMs, OMEMS 2002 - Conference Digest

Volumn , Issue , 2002, Pages 137-138

  Awatani, Y ^a   Matsumoto, Y ^a   Kato, K ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS; MOEMS; REINFORCED PLASTICS; SILICON WAFERS; WAFER BONDING;

DICING METHOD; DICING PROCESS; GLASS CAP WAFERS; MASS PRODUCTION PROCESS; PROCESS CONDITION; SCREEN-PRINTED; THERMO-COMPRESSION; THERMOPLASTIC ADHESIVE;

GLASS BONDING;

EID: 84963717617     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/OMEMS.2002.1031481     Document Type: Conference Paper

References (2)

1. M.-H. Kiang, O. Solgaard, R. S. Muller, and K. Y. Lau, "Micromachined Polysilicon Microscanners for Barcode Readers", IEEE Photon. Technol. Lett., vol. 8, no. 12, 1996, pp. 1707-9.
2. Data sheet of STAYSTIK, Techno alpha Co., Ltd