A low-temperature wafer bonding technique using patternable materials

Journal of Micromechanics and Microengineering

Volumn 12, Issue 5, 2002, Pages 611-615

  Pan, C T ^a   Yang, H ^a,b   Shen, S C ^a,c   Chou, M C ^a   Chou, H P ^c  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; SILICON WAFERS;

PATTERN SPATIAL RESOLUTION; PHOTODEFINABLE MATERIAL;

MICROELECTRONIC PROCESSING;

EID: 0036735653     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/5/315     Document Type: Article

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