Low-temperature full wafer adhesive bonding

Journal of Micromechanics and Microengineering

Volumn 11, Issue 2, 2001, Pages 100-107

  Niklaus, F ^a   Enoksson, P ^a   Kalvesten E ^a   Stemme, G ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); PHOTORESISTS; PLASTIC COATINGS; POLYIMIDES; PRESSURE EFFECTS; THERMAL EFFECTS;

BENZOCYCLOBUTENE (BCB); WAFER ADHESIVE BONDING;

BONDING;

EID: 0035277919     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/2/303     Document Type: Article

References (21)

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11. CMOS compatible wafer scale adhesive bonding for circuit transfer
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15. A low-cost substrate transfer technology for fully integrated transceivers
16. Low temperature Nafion bonding of silicon wafers
17. Design rules for polyimide solvent bonding