Adhesive wafer bonding for MEMS applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5116 I, Issue , 2003, Pages 160-167

  Dragoi, V ^a   Glinsner, T ^a   Mittendorfer, G ^a   Wieder, B ^a   Lindner, P ^a  

^a EV GROUP   (Austria)

Author keywords

Adhesive wafer bonding; BCB; Dissimilar materials; Low temperature processing; MEMS; Spin on glass

Indexed keywords

ADHESIVES; ANNEALING; DISSIMILAR MATERIALS; ELECTRONICS PACKAGING; ENCAPSULATION; LOW TEMPERATURE PRODUCTION; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SUBSTRATES;

ADHESIVE WAFER BONDING; BENZOCYCLOBUTENE; SURFACE PLANARIZATION;

BONDING;

EID: 0042284430     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.499077     Document Type: Conference Paper

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