Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8

Journal of Micromechanics and Microengineering

Volumn 13, Issue 5, 2003, Pages 732-738

  Li, Sheng ^a   Freidhoff, Carl B ^b   Young, Robert M ^b   Ghodssi, Reza ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; FABRICATION; FLUIDIC DEVICES; INTERFACIAL ENERGY; LEAKAGE (FLUID); NOZZLES;

LOW TEMPERATURE WAFER LEVEL BONDING; MICRONOZZLES;

MICROELECTROMECHANICAL DEVICES;

EID: 0141495420     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/5/328     Document Type: Article

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